"MI550** is positioning to challenge Rubin Ultra in 2H27. AMD's 2.5D/3D packagin

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"MI550** is positioning to challenge Rubin Ultra in 2H27. AMD's 2.5D/3D packagin

· @zephyr_z9

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"MI550 is positioning to challenge Rubin Ultra in 2H27. AMD's 2.5D/3D packaging expertise enables a 4-die/12 HBM4e design, vs Rubin Ultra 2-die package (and MCM for 2 sets of 2-die)." Need to watch out for the yield (if AMD goes for a 4 die design)

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