The cleanest physics-down chain captured this week: package bodies grew from 58x55mm on Hopper to about 95x98mm on Rubin and build-up layers from 10-14 to 24+, so wet-process steps, lamination steps and adhesion chemistry scale with substrate complexity rather than unit count. A test of whether substrate coverage stops one layer too shallow; all four names are foreign primaries.
One of the most useful frameworks in semiconductor research is to think in derivatives. The first derivative is often recognized early. For example, the insatiable demand for more AI accelerators has been well established. And therefore, the market has since moved down the
The cleanest physics-down chain captured this week: package bodies grew from 58x55mm on Hopper to about 95x98mm on Rubin and build-up layers from 10-14 to 24+, so wet-process steps, lamination steps and adhesion chemistry scale with substrate complexity rather than unit count. A test of whether substrate coverage stops one layer too shallow; all four names are foreign primaries.
Tweets, videos, filings, articles, and source pages tied to this read.