SemiAnalysis — HBM de-specs to bandwidth; hybrid bonding goes from when to if

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SemiAnalysis — HBM de-specs to bandwidth; hybrid bonding goes from when to if

SK Hynix has now said publicly that 16-high HBM stacks are hard, and buyers are picking bandwidth over capacity. That removes the stack-height problem hybrid bonding was supposed to solve, and SemiAnalysis adds that Samsung's wafer-to-wafer process for its next DRAM node is about two years out and is a different tool set. It's a supply-side read on HBM, and a direct challenge to the bonding-equipment estimates the firm says still assume the technology.

Open on X SemiAnalysis (@SemiAnalysis_)
SemiAnalysis✓ @SemiAnalysis_
Oct 8

Memory suppliers are finally acknowledging our HBM de-spec call. SK Hynix publicly said 16-hi is difficult, and the market is now prioritizing bandwidth over capacity. Hybrid bonding’s case in HBM was always stack height, and at 4-hi and 8-hi there is no height problem to solve.

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SK Hynix has now said publicly that 16-high HBM stacks are hard, and buyers are picking bandwidth over capacity. That removes the stack-height problem hybrid bonding was supposed to solve, and SemiAnalysis adds that Samsung's wafer-to-wafer process for its next DRAM node is about two years out and is a different tool set. It's a supply-side read on HBM, and a direct challenge to the bonding-equipment estimates the firm says still assume the technology.

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