One chain from three items: GlobalFoundries' five-year, $2 billion deal to make silicon interposers for TSMC in New York (volume from the first half of 2028; REX Shares' October 12 chipmaking update carries the same $2 billion figure), the Vanguard–NXP Singapore fab cutting its planned output by a fifth to make room for them, and reported 10–30% price hikes at Taiwan's packaging and test houses. The argument is that AI packaging now bids for the same mature-node capacity as power and analog chips, which is how older fabs get pricing power.
three receipts lately about the dullest piece of silicon in an ai chip: the silicon interposer 1. $GFS signed a 5 year, $2B deal to make it for TSMC in upstate new york. First us source, volume ramp in the first half of 2028. 2. Vanguard and nxp's new singapore fab, built for
One chain from three items: GlobalFoundries' five-year, $2 billion deal to make silicon interposers for TSMC in New York (volume from the first half of 2028; REX Shares' October 12 chipmaking update carries the same $2 billion figure), the Vanguard–NXP Singapore fab cutting its planned output by a fifth to make room for them, and reported 10–30% price hikes at Taiwan's packaging and test houses. The argument is that AI packaging now bids for the same mature-node capacity as power and analog chips, which is how older fabs get pricing power.
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