aibottlenecks 113-name book coverage diff vs watchlists
aibottlenecks 113-name book coverage diff vs watchlists
Question: aibottlenecks 113-name book coverage diff vs watchlists Verdict: 86 of 113 covered; 3 clean-US adds JCI PSTG NTAP, 6 skips, 17 foreign gated
Summary
Coverage diff of the aibottlenecks.app 113-name chokepoint book (2026-06-03 baseline; structured pull research/capture/dashboards/aibottlenecks/2026-06-04-rest.json) against all 41+ watchlists. Resolution goes through _aliases.json and _securities.json scanner-family mapping, so a foreign primary that we track under its OTC-ADR/scanner canonical (e.g. 4062.T→IBIDF, SIVE.ST→SIVEF) counts as covered.
Result: 86 of 113 covered, 27 gaps. The original 2026-06-03 "priority cluster" the task row flagged as gaps has almost entirely closed via the June demian_ai/aibottlenecks watchlist adds — Resonac (4004.T→SHWDF, nearline-storage), ASE (3711.TW→ASX), nLIGHT LASR, MXL, LPKF (LPKFF→LPK.DE), ASPI, IQE (IQE.L→IQEPF), Sivers (SIVE.ST→SIVEF), Ibiden (4062.T→IBIDF), Soitec SOI.PA, SK Hynix 000660.KS, Samsung 005930.KS are all now tracked. This diff is the reconcile that confirms those landed and isolates what is genuinely still missing.
The 27 gaps, triaged
Conviction/headline context below is aibottlenecks' own LLM-graded data (their delayed Yahoo pricing, ~2026-06-03) — used only to prioritize, not as our price truth.
A. Clean US-listed → ADD (3)
| Ticker | Name | aibottlenecks | Why add (trend-hold) |
|---|---|---|---|
| JCI | Johnson Controls | conf=high; "$20B record backlog, +30% orders" | Data-center thermal/HVAC. Direct peer to TT (Trane) + MOD (Modine) already in ai-infrastructure — completes the cooling cohort. Durable profitable large-cap. |
| PSTG | Pure Storage | conf=high; "55% product-rev growth, NAND sold out through 2028, hyperscaler design win" | All-flash AI-storage systems w/ hyperscaler win. Secular AI-data demand, growing, clean US large-cap. |
| NTAP | NetApp | conf=medium; "in bull range, Q3 FY26 intact" | Enterprise AI storage, profitable dividend large-cap. Rounds out the storage-systems cohort next to DELL. |
All three route to ai-infrastructure (the datacenter-buildout catch-all that already holds TT/MOD/DELL/storage). Mutation filed.
B. Trend-hold SKIP (6) — pre-rev / micro-cap / off-thesis
- TMC (TMC the metals co) — deep-sea mining, pre-revenue, thesis hinges on Q1-2027 NOAA permit. Catalyst lottery, explicitly against user style.
- ENVX (Enovix) — silicon battery, pre-profit $8 small-cap; battery is not core AI-bottleneck.
- ALOY (REalloys) — rare-earth alloys micro-cap, pre-scale; theme already covered by
MP. - TRT (Trio-Tech) — semi test-services micro-cap (~$50M), illiquid.
- HGRAF (HydroGraph) — graphene, Canadian OTC-foreign, pre-scale capacity ramp.
- AMSC (American Superconductor) — grid power-electronics small-cap; grid-buildout already holds the durable large-caps (GEV/ETN/HUBB/PWR/POWL), AMSC is the speculative tail. Leave out; revisit only if it becomes a repeat multi-voice ping.
C. Foreign primary / ADR → GATED, do NOT bulk-add (18 symbols / ~17 names)
Per CLAUDE.md "research-only foreign primaries stay out of watchlist/trade rows unless explicitly authorized." Named here for a one-shot user decision. Four already have staged _securities.json families (add = one CLI line if authorized): DISCO 6146.T, Unimicron 3037.TW, Nan-Ya PCB 8046.TW, Sumitomo Electric 5802.T/SMTOY.
- HBM/advanced-packaging Asia: Samsung Electro-Mechanics
009150.KS, KYEC2449.TW, Ajinomoto2802.T(ABF substrate), Unimicron3037.TW, Auros322310.KS, SUMCO3436.T(300mm wafers), DISCO6146.T(dicing/grinding), TOWA6315.T(molding), ShunSin6451.TW, MSSCORPS6830.TW, Tokyo Seimitsu7729.T, Nan-Ya PCB8046.TW. - Substrate/materials: Sumitomo Electric
5802.T/SMTOY(InP shortage). - Photonics: WIN Semi
3105.TWO, LuxNet4979.TWO. - Power/materials: Schneider Electric
SU.PA(datacenter power, conf=high), IlukaILU.AX(rare-earth refining).
The HBM/packaging cluster is the densest remaining coverage hole and is a coherent basket — worth a single "authorize the ADR/foreign-primary tranche?" decision rather than name-by-name. DISCO/Unimicron/Nan-Ya/SumitomoElec are the highest-conviction (conf=high on aibottlenecks) and are pre-staged.
Decision
- ADD (clean US): JCI, PSTG, NTAP →
ai-infrastructure. - SKIP (trend-hold): TMC, ENVX, ALOY, TRT, HGRAF, AMSC.
- GATE (needs user authorization): the 17-name foreign-primary/ADR list above; recommend authorizing the 4 pre-staged HBM/packaging families (DISCO/Unimicron/Nan-Ya PCB/Sumitomo Electric) first.
Price truth: the gap names are not in
research/market-engine/data/summaries/yet (that absence is the coverage finding) — once JCI/PSTG/NTAP are added they will populate on the next precompute. All conviction/price figures cited above are aibottlenecks' own delayed data (~2026-06-03), not our price truth.
Related
8 eventsNo direct external sources are attached to this read.